Data carrier with an electronic module and a method for producing the same

ABSTRACT

The invention relates to a data carrier comprising a one- or multilayer card body in which an electronic module is embedded. The layers of the card body consist of paper and/or cardboard and are interconnected for example by thermally activable adhesive or contact adhesive. The cards can be produced by continuous technology, the individual card layers being supplied from endless rolls, provided with the necessary windows for receiving the modules, and finally interconnected. The modules are inserted in the resulting gaps. The individual cards are punched out.

This invention relates to a one- or multilayer data carrier with anembedded electronic module, in particular a chip card. Furthermore theinvention relates to a production method for such data carriers.

In the past various IC cards have become known which are produced byvarious methods.

For example EP-B1 0 140 230 discloses an IC card constructed from aplurality of plastic layers and produced by the so-called laminatingtechnique. For this purpose one provides a structure consisting of anupper cover layer, at least one core layer and a lower cover layer.Between the upper cover layer and the core layer one places anelectronic module consisting of a substrate on which an integratedcircuit with contact surfaces is disposed. This structure isinterconnected under the action of heat and pressure, the contactsurfaces of the module coming to lie in gaps in the upper cover layer,and the integrated circuit in a gap in the core foil. The compound ofplastic layers arises from the layers softening and interconnectingduring lamination. In the finished card the module is embedded betweenthe upper cover layer and the core layer.

EP-A1 0 493 738 further discloses an IC card produced by the so-calledmounting approach. This technique is characterized in that a card bodywith a multistep gap is first provided. The electronic module is thenintroduced into the gap and glued. This is done with a thermallyactivable adhesive in EP-A1 0 493 738.

The provided card body can first be produced without a gap e.g. bylaminating a plurality of plastic layers. In a further step the gap isthen produced e.g. by milling.

However the card body can also be produced differently. For exampleDE-A1 41 42 392 discloses manufacturing the card body by injectionmolding. One uses an injection mold whose cavity corresponds to the formof a card body. After the cavity has been almost completely filled thegap is produced in the card body during the injection molding processwith a movable die which can be moved into the cavity. After completionof the card body the electronic module is glued in by a second step.

Alternatively it is possible to use the movable die directly forpressing the module into the as yet unhardened plastic material of theplastic body. In this case the production of the card body and theembedding of the module are completed in one operation.

IC cards produced by injection molding are also known from EP-B1 0 277854. Here it is proposed that the electronic module be already insertedin the mold while the plastic material is being injected. The module isfixed in the mold by suction air applied from outside. The modulecasting for protecting the integrated circuit is formed on a slant andthus held reliably in the card body by the surrounding injection moldingmaterial.

In addition to the method steps for producing the card body andembedding the module according to DE-A1 41 42 392 or EP-B1 0 277 854,further measures are to be provided for applying printed images on thecard surface. However, EP-B1 0 412 893 discloses an injection moldingmethod for producing IC cards wherein the IC card can be alreadyprovided with a graphic element during injection molding. For thispurpose a card-sized paper layer printed on both sides is inserted inthe mold. After that a transparent plastic material is injected in themold so that the printed image can be seen from both sides of the cardin the finished card body. In this method a gap for the electronicmodule can either be produced by a die protruding into the mold, or themodule can be fixed directly and molded around in the mold.

In the stated methods the one- or multilayer card body consists ofplastic material. With the laminating technique the card layers areinterconnected under the action of heat and pressure and finally cooled.This takes a relatively long time. Although such cards are produced "inpackages" in a stack of so-called multiple-copy sheets, and although theelectronic module can already be laminated in during welding of theplastic layers, the throughput of finished cards per unit of time isgreatly limited. This limitation is naturally also reflected in the cardprice.

With the injection molding technique the production of the card body orthe IC card is relatively easy and less time-consuming to perform.However the plants for producing injection-molded parts orinjection-molded cards have a high purchasing price. Furthermore theseplants are designed predominantly for single card production so that thethroughput per unit of time is in the same range as with laminatedcards.

It follows from the above that a further cost reduction in the unitprice of an IC card is possible only to a small extent, if at all, withthe techniques used up to now for producing the IC card.

It is therefore the problem of the invention to propose an IC cardwherein the card structure and the method for producing the card permita further cost reduction.

This problem is solved by the characterizing features of the main claim.

The advantages of the invention are to be seen in particular in that thepaper layers required for the card structure can be supplied from aroll, regardless of whether the card is a one-layer or multilayer card,and the paper IC card can thus be manufactured by continuous technology.It is very easy to glue together a plurality of layers, since the layersglued either cold or using thin thermally activable adhesives can beproduced without long waiting times. Furthermore all techniques knownfrom conventional paper processing can be transferred to the productionof the paper IC card, in terms of both the connection of the individualcard layers and the printing of the card layers. For example theprinting techniques known from paper technology can be usedcost-effectively, e.g. by web or sheet printing of the layers. One canachieve all printing qualities known from paper technology. Furthermore,the paper IC card is environment-friendly and recyclable, unlike theplastic card. A further advantage of the IC card is that it has highthermostability, depending on the adhesive used. Also, due to itsabsorbent surface the paper IC card can be provided with individual datain a simple manner, for example using an ink jet printer. Finally, thepaper IC card can be provided with all security features which havebecome known from paper-of-value production. For example it is possibleto provide one of the paper layers with a security thread known frombank-note production and to integrate it in the card.

As the prior art shows, the entire, almost twenty-year development ofthe IC card has been oriented toward plastic as the card body material.This is readily understandable since plastic is a material which is bothdurable and has high resistance.

In the course of development of the IC card, however, applications havealso become known in which the cards are used for shorter terms. Anexample of such an application is the telephone card. Plastic has beensimply adopted as the material for telephone cards as well. There isthus evidently a prejudice among experts against considering materialsother than plastic for the production of cards with integrated circuits,because it is thought that only this material can yield cards offeringthe necessary protection for the sensitive IC module. Despite theabovementioned considerable advantages which a paper or cardboard cardoffers, this material has in any case been disregarded up to now for theproduction of cards with integrated circuits.

In a preferred embodiment of the invention a paper card body is firstproduced in which the electronic module is later glued. The card bodycan consist of a plurality of paper layers or of one cardboard layer.

In a further embodiment of the invention the electronic module islaminated into the card body during production of the cards. The modulecan either be embedded between two layers or glued into a gap. e.g. witha liquid adhesive

In a further preferred embodiment an electronic module suitable fornoncontacting data exchange is introduced into a gap in the core layerduring lamination of a plurality of card layers.

Some embodiments and further advantages of the invention will beexplained more closely in connection with the following figures, inwhich:

FIG. 1 shows an IC card in a plan view

FIG. 2 shows a cross section through a card body layer structure

FIG. 3 shows a cross section through a card body with a gap

FIG. 4 shows a layer structure for a card to be produced by thelaminating technique in cross section

FIG. 5 shows a layer structure of a card in cross section

FIG. 6 shows the layer structure from FIG. 5 in cross section but with agap

FIG. 7 shows a layer structure of a card before connection of theindividual layers in cross section

FIG. 8 shows the layer structure from FIG. 7 in cross section, the cardlayers being interconnected

FIG. 9 shows an IC card in cross section

FIG. 10 shows a card body with a gap in cross section

FIG. 11 shows an IC card in cross section

FIG. 12 shows a layer structure for a card to be produced by thelaminating technique in cross section

FIG. 13 shows an IC card in cross section

FIG. 14 shows an IC card in cross section

FIG. 15 shows an IC card in cross section

FIG. 16 shows an IC card in cross section

FIG. 17a-e show a method for producing an IC card

FIG. 18 shows a multilayer endless band in a plan view

FIG. 19 shows a cross section from FIG. 18

FIG. 20 shows an IC card in a plan view

FIG. 21 shows a stack of IC cards in cross section.

FIG. 1 shows an IC card with electronic module 1 in card body 3 in aplan view. Card body 3 has dimensions which are fixed in an ISO standarddesignated ISO 7810. Electronic module 1 is embedded in the card body ata defined position likewise fixed by an ISO standard designated ISO7816/2. According to the invention card body 3 of the IC card isproduced from one or a plurality of paper and/or cardboard layers.

FIG. 2 shows a multilayer card structure in cross section prior tolamination of the individual card layers. The card structure consists ofupper cover layer 5, core layer 7 and lower cover layer 9. Core layer 7is provided on both sides with thin thermally activable adhesive layer11 used for gluing together the layers. Before the individual layers arebrought together, windows 13, 15 are punched in layers 5 and 7 so that atwo-step gap arises in the card body after the three layers are broughttogether and glued. If a plurality of core layers are used it is alsopossible to produce a multistep gap in the card body, whereby thewindows become increasingly small in the individual core layers,considered from the upper cover layer. Such a card structure isespecially advantageous when the casting compound of the electronicmodule has a drop shape, as shown e.g. in FIG. 9, since the contours ofthe gap can then be readily adapted to the shape of the casting compoundand the bottom area of the gap is small.

The card laminate can be produced in high throughputs. Layers 5, 7 and 9can thus be supplied from rolls and guided for lamination through heatedlaminating rolls between which the thermally activable adhesive layersare activated. One thus obtains an endless laminate provided at suitableintervals with gaps for receiving the electronic modules. The individualcard bodies are punched out of this endless laminate in a further methodstep. Electronic modules 1 are glued into the card body gaps. Thenecessary adhesive can either be located directly on the module or beintroduced into the gap e.g. in the form of liquid adhesive. The modulecan be incorporated in the card body before or after the card is punchedout.

To increase the bond strength between the module and the card body onecan, instead of using thermally activable adhesive 11 located above thecard layer, provide core layer 7 with cloth 8 impregnated with athermally activable adhesive. FIG. 2 indicates the cloth by the dots inupper thermally activable layer 11. The cloth can be selected so as toallow optimum bond strength between the electronic module and the cardbody. In the finished card the cloth is thus located between cover layer5 and core layer 7. The firm connection of the module with the cloththus anchors the module between the card layers in the finished IC card.As an alternative to a cloth located all over core layer 7, one can alsoprovide a cloth or foil only in the area of window 15 in core layer 7.This will also achieve the abovementioned effects.

The module shown in FIG. 2 bears on surface 12 contact surfaces forcontacting communication. Alternatively the IC card can also be providedwith an electronic module suitable for noncontacting data exchange. Sucha module can be inserted in window 15. In this case one can thusdispense with window 13 in cover layer 5, so that in the finished ICcard the module for noncontacting data exchange is located in window 15between cover layers 5 and 9.

FIG. 3 shows the card body of a single-layer cardboard card in crosssection. Cardboard 17 can likewise be supplied from a roll. Windows 15are punched in the cardboard at suitable intervals. Further, bydebossing cardboard 17 in the area of window 15 one produces shallow gap19 which has a greater diameter than window 15. Electronic module 1 canbe glued into the resulting gap in the cardboard, the bottom of gap 19being used as an adhesive layer. The module can again be glued into thegap using an adhesive located on the module, which can be a thermallyactivable adhesive or a contact adhesive, or using a liquid adhesive.The card can be punched out of the endless cardboard before or aftergluing. In the finished IC card a part of window 15 which is not filledby the module can be located in the module area on the back of the card.To give the card a better appearance one can additionally close thispart, e.g. by casting with a casting compound or by other measures.

FIG. 4 again shows a multilayer card structure prior to lamination incross section. Layers 5, 7 and 9 are identical with those from FIG. 2.In addition to these layers the structure has separate adhesive layers21 and 23 which are also provided with suitable punchings.

Adhesive layers 21 and 23 can be formed either as thermally activablelayers or as contact adhesive layers. In the latter case the windowsmust be produced in the layers when the layers are still coated with asilicone band in order to prevent the punching tools from sticking.After the punching of the windows the silicone bands can be rolled offthe contact adhesive layers and onto other rolls.

Electronic module 1 can already be inserted in the windows of adhesivelayer 21 prior to roll lamination in such a way that the contact surfacearea lies on adhesive layer 21 and the area of the module receiving theintegrated circuit is located in the window, as shown in the figure.During lamination of the shown card layers the shown module is thusglued in the card body gap at the same time as adhesive layer 21.

If the electronic module is not to be glued in the gap during laminationof the card body it is also possible to punch out the window in adhesivelayer 21 with exactly the size of the window in cover layer 5. In thiscase the shoulder of the two-step gap remains free from the adhesivelayer during lamination of the layers so that no adhesive material canpenetrate onto the surface of the card during heating of this layer.Such an embodiment is especially advantageous when the punched-out cardbody is to be stored as an intermediate product. The card structureshown in FIG. 4 is also especially suitable for embedding a module fornoncontacting data exchange. In this case one can again dispense withthe windows in layers 5 and 21.

FIGS. 2 and 4 show multilayer card structures in which the individuallayers already have windows before joining which make up a gap in thecard body after the layers are joined. In contrast, FIGS. 5 to 8 showembodiments in which the gap is provided in the card body subsequently.

FIG. 5 shows a card structure consisting of core layer 7 and coverlayers 5 and 9, the layers being interconnected by thermally activableadhesive layers 11. The thermally activable adhesive layers used can bee.g. extremely thin polyethylene (PE) foils or amorphous polyethyleneterephthalate (APET) foils, which are applied to core layer 7 on bothsides. In cover layer 5 one first produces with cutting tool 41 edge 43which fixes the edge of the first part of a two-step gap. One then usesa milling tool to produce two-step gap 19 shown in FIG. 6 in the cardbody in such a way as to expose thermally activable adhesive layer 11 onshoulder 45.

The use of a cutting tool for producing edge 43 has the advantage that aclean and optically flawless edge arises in the visible area of thefinished chip card, whereas if one uses a milling tool for producing agap in the paper one cannot avoid "fraying" on the edges, as indicatedin FIG. 6 in the edge area of the bottom part of the two-step gap. It isof course also possible to dispense with the use of a cutting tool andproduce the gap solely with a milling tool.

An electronic module, as shown for example in FIG. 2, is introduced intotwo-step gap 19 in the card body (see FIG. 6) and glued on shoulder 45with the help of thermally activable adhesive layer 11 exposed duringthe milling process. It is of course also possible to provide theelectronic module additionally with an adhesive to improve the bond withthe card body. This is especially advantageous when thermally activableadhesive layers 11 are very thin and adhesive layer 11 in shoulder area45 of the gap is damaged or removed intentionally or unintentionallyduring the milling process.

FIG. 7 shows the same layer structure as FIG. 5, but cover layers 5 and9 are not yet connected with core layer 7. In the shown embodiment thecard layers are interconnected under the action of heat and pressurewith heated dies 45 and 47, heated dies 45 and 47 having gaps 49 and 51in the area where the gap is subsequently produced in the card body. Inthe area of these gaps thermally activable layers 11 are thus notactivated when the layers are connected so that no bond is producedbetween the card layers in this area.

FIG. 8 shows the card structure from FIG. 7, the individual card layersnow being interconnected. Due to the special design of the heated diescover layer 5 has not interconnected with core layer 7 in area 53, orcover layer 9 with core layer 7 in area 55. Using cutting tool 41 onecan now produce the top part of a two-step gap by first introducingcutting tool 41 into the card body at least far enough for cover layer 5to be severed. The part of the cover layer located within the edge ofcut can then be easily removed since this part has not bonded withadhesive layer 11. The bottom part of two-step gap 19 can be producedanalogously using cutting tool 57. One thus obtains a card body, asalready shown in FIG. 6, with a two-step gap which now has clean edgesof cut in the entire wall area. The described method is of course notrestricted to the production of a two-step gap. One can also producestepless or multistep gaps in the card body in analogous fashion.

The production method described in connection with FIGS. 7 and 8 issuited especially for card bodies consisting exclusively of paper andcardboard, since the individual paper layers are not softened duringconnection, as happens during lamination of plastic layers. With thehelp of the shown heated dies the heat is conducted only through thepaper to the thermally activable adhesive layers, which are thenactivated. The paper layers themselves thus remain dimensionally stablethroughout the production method, so that there is no distortion of thepaper layers whatsoever even at the transitions to the unheated areas(see FIG. 7). The bottom area of the two-step gap is thus very plane inthe finished card body.

FIG. 9 shows a single-layer card body with two-step gap 19 in whichelectronic module 1 is glued with liquid adhesive 59. In the daily useof chip cards there are bending loads which act on the card bodyincluding the area of the electronic module. Due to these bending loadsand the splittability of paper, the paper in the embodiment shown inFIG. 9 can split in shoulder area 45 (see FIG. 6) in gap 19 directlybelow the liquid adhesive, so that the electronic module comes out ofthe card body in the course of time.

Although paper chip cards are preferably to be used for applications inwhich the card need have only a short service life, and a card structureas shown in FIG. 9 is thus basically durable enough, the compoundbetween the electronic module and the card body can be improved byproviding two-step gap 19 with undercuts 63 using suitable milling tool61, as shown in FIG. 10.

A dosed quantity of liquid adhesive 59 is introduced in two-step gap 19,being distributed in gap 19 upon incorporation of electronic module 1 insuch a way that undercuts 63 are also filled with liquid adhesive 59(see FIGS. 10 and 11). Thus electronic module 1 is anchored in the cardbody and secured against forces acting perpendicular to the cardsurface. Furthermore the liquid adhesive now moistening the entire wallarea of the gap also offers good protection against splitting of thepaper in this area. Alternatively it is of course also possible todispense with undercuts and dose the liquid adhesive so that it moistensthe wall area largely or completely in the finished card.

FIG. 12 again shows a multilayer card body prior to lamination in crosssection. Individual layers 5, 7 and 9 are identical with the layersshown in FIG. 2. However upper cover layer 5 has instead of window 13two windows 25 separated by bar 27. Before lamination electronic module1 is inserted in window 15 of core layer 7 in the way indicated in FIG.12. During roll lamination of the layers module 1 is glued to layer 7and embedded additionally between layers 5 and 7. In the finished ICcard the contact surfaces of module 1 are located in windows 25 and theembedding between the layers brought about by bar 27. A moduleespecially suitable for the abovementioned production technique isdescribed exactly in EP-B1 0 140 230.

FIGS. 13 to 16 show further embodiments in which the electronic moduleis already anchored in the card body during production of the card byembedding parts of the module between two card layers.

FIG. 13 shows a multilayer card structure consisting of cover layers 5and 9 and core layers 7 and 8. Electronic module 1 incorporated in theshown card structure has anchoring frame 65 which protrudes beyondcasting 67 of the module and is already embedded between two card layers5 and 7 during production of the cards. As shown in FIG. 13, anchoringframe 65 is surrounded on both sides by thermally activable adhesivelayers so that a good bond arises between the anchoring frame and thecard body. In a preferred embodiment the anchoring frame is formed as acloth into which adhesive material from adjacent adhesive layers 11 canpenetrate during card production. This results in an indirect compoundof adjacent adhesive layers 11 and an improved anchoring of the modulein the card body.

FIGS. 14 to 16 show further embodiments in which the electronic moduleis embedded between two card layers. The modules in these figures allhave the same structure and are referred to in general as lead framemodules. They consist of metal wafer 69 in which a contact layout isformed and which has applied to one side IC module 71 which iselectrically connected with the contact surfaces of the contact layout.The IC module and electric connections are surrounded by a castingcompound for protection from mechanical loads. In the shown embodimentsthe anchoring frame is formed by extensions of the contact surfaceswhich protrude beyond the actual contact layout and are embedded betweentwo card layers.

FIG. 14 shows basically the same card structure as FIG. 13. Theanchoring frame is already bent into the card interior during productionof the card, i.e. during connection of the individual layers, resultingin the structure shown in FIG. 14. Production thus takes placeanalogously to the production already explained in conjunction with FIG.12.

FIG. 15 shows a chip card in cross section, wherein the anchoring frameof the lead frame module is not bent and contact surfaces 73 of theelectronic module are located below the card surface. The contactsurfaces can be provided with relief punchings 75 in the transitionalarea to the extensions used for anchoring, so that they remain connectedwith the extensions only by thin bars. This leads to a mechanicaldecoupling of the transitional area between module and anchoring frameand thus to relief in this area upon bending loads on the card, so thatadhesive layer 11 does not come off card layer 7 therebelow as quickly,e.g. due to tearing or splitting of this card layer.

FIG. 16 shows basically the same cross section as FIG. 15. However,adhesive layer 11 extending below the anchoring frame goes as far as theedge area of the bottom part of the two-step gap, thereby obtaining agreater adhesive surface for gluing the electronic module. FIG. 16 alsoshows heated die 77 which can be used to further improve the compoundbetween the anchoring frame and adhesive layers 11 in a separate unit.

FIG.17 finally shows a production method for a paper IC card consistingof two layers connected by means of a contact adhesive. In a firstmethod step (FIG. 17a) compound elements 33 are produced from contactadhesive band 31 coated with silicone band 29. This is done by methodsknown from labeling technology which are familiar to the expert and neednot be explained more closely here. Additionally the production of suchcompound elements is known from DE-OS 41 22 049. Silicone band 29provided with compound elements 33 is brought together with paper layer35 provided with contact adhesive layer 37. Since the adhesion of thecompound element is greater to the contact adhesive layer than to thesilicone layer, the compound element can be transferred to contactadhesive band 37, yielding the intermediate product shown in FIG. 17b.In a further method step (FIG. 17c) electronic modules 1 are punched outof module band 39 and glued to compound element 33. The intermediateproduct shown in FIG. 17c is brought together with prepunched cardboardband 17 with windows 15 in such a way that the modules glued on paperlayer 35 come to lie in the windows. Finally, finished paper IC cards 3are punched out of the endless band, as shown in FIG. 17e. It is ofcourse also possible to manufacture the paper card individually. In thiscase the individual card layers shown in the figures are alreadycard-sized, so that one already obtains the card body in the desireddimensions after connection of the individual layers.

The above statements always relate to embodiments in which finishedpaper or cardboard webs are provided or brought together and anelectronic module inserted in the card body at the same time orsubsequently. Alternatively it is also possible already to incorporateelectronic modules in the cardboard during production of the latter.This method can be applied especially advantageously with electronicmodules for noncontacting data exchange, e.g. consisting of aring-shaped coil and an integrated circuit electrically connected withthe coil, since these modules have lower requirements for positionalaccuracy in the finished data carrier than modules for contacting dataexchange. Further, the electronic modules for noncontacting dataexchange are surrounded on all sides by cardboard and embeddedpositively therein, without elaborate measures having to be taken forproducing a channel for the module coil. The electronic modules arepreferably embedded in the cardboard in matrix form so that one finallyobtains a multiple-copy sheet or multiple-copy web out of whichindividual data carriers with modules are punched. The sheet can alreadybe provided during production with position markings to permit thepunching tool to be positioned exactly so that, after punching, theelectronic module is positioned properly relative to the outside edgesof the data carrier. It is further possible to provide the sheet with aprinted image before punching, so that the data carrier is alreadyfinished after punching. Alternatively it is possible to provide themultiple-copy sheet bearing electronic modules for noncontacting dataexchange with printed cover layers on both sides and then to punch outthe individual data carriers. In this case the position markings for thepunching tool can be provided in the printed image of a cover layer sothat position markings in the cardboard can be dispensed with.

One can take various measures which are explained in connection withFIGS. 18 to 21 to prevent splitting of the paper or cardboard in theedge area of the punched-out paper IC cards.

FIG. 18 shows in a plan view a detail of an endless band having amultilayer structure, for example that shown in FIG. 5 in cross section.The core layer or layers of the multilayer card structure containthrough holes 79 in the area where punching edge 81 of the card to bepunched out is located.

FIG. 19 shows a cross section along line A--A of FIG. 18. Duringconnection of the individual card layers material from adjacentthermally activable adhesive layers 11 penetrates into the through holesso that cover layers 5 and 9 are indirectly interconnected. If one nowpunches the card out along punching edge 81 in such a way that at leasta part of each through hole 79 is located in the card body, as indicatedin FIGS. 18 and 19, one obtains a card edge which consists in the corearea alternately of paper or cardboard and adhesive material from theadhesive layers. This largely prevents splitting of the core layer.

FIG. 20 shows an already punched-out paper IC card in a plan view. Toprotect the edge of the card from splitting, special protecting lacquer85 is applied thereto with spreading unit 83. The cards can be processedeither individually or several in a stack simultaneously.

FIG. 21 shows a stack of card bodies 3 in cross section to the edges ofwhich protecting lacquer 85 is transferred from transfer band 87 withthe help of heated die 89 by the transfer method.

The edges of the paper cards are preferably provided with protectinglacquer if the cards have a single-layer card structure, since in thiscase the method explained in conjunction with FIGS. 18 and 19 isunfeasible. Multilayer cards can of course also be provided withprotecting lacquer, whereby this lacquer can be the only, or anadditional, protective measure against splitting of the card edge. Theprotecting lacquer can be colored and used as additional identificationor an additional security feature.

Finally it should be mentioned that the layers forming the cover layersof the card can already be provided with printed images, etc.,completely or in certain areas before production of the IC cards,whereby all common printing processes can be used such as reliefembossing, offset printing, steel gravure printing, screen printing,letterpress printing, blind blocking, dough printing, wallpaperprinting, hectographic printing, etc. By using art paper one can furtherincrease the high printing quality already achievable on paper. One canalso include certain information (e.g. the credit balance of a newtelephone card, etc.) in the printed image in embossed printing, e.g. byembossing or by especially thick inking. In the finished card theexternal surfaces of the cover layers can be protected by a thin layerof lacquer consisting e.g. of nitrocellulose lacquer, calender lacquer,UV-curing lacquer, electron-beam curing lacquer, etc. The lacquer can beapplied in the form of gloss lacquer or matte lacquer. It is alsopossible to grain the layers of lacquer.

Individual layers can additionally be provided with security elements,such as watermarks, scents, security threads, fluorescent fibers inpaper or cardboard, color capsules in paper fibers, holograms, etc.

It is also especially easy to apply other elements to paper cards, suchas a magnetic track by applying a waterbase magnetic lacquer or a matchrubbing surface.

Finally, threads can be worked into the thicker paper layers orcardboard layers during production of these layers to make these layersless likely to split. Suitable techniques are known from paperprocessing and will not be explained more closely here. For connectingthe individual paper or cardboard layers one can use not only thermallyactivable adhesives but also contact adhesives or liquid adhesives. Toprevent splitting of the paper or cardboard in the area of the gap forthe module one can strengthen these areas by cloth, liquid adhesives orresins.

We claim:
 1. A data carrier formed as an IC card consisting of at leastone of paper and cardboard, said data carrier comprising a card bodymade of at least one of paper and cardboard, and an electronic modulefor exchanging data with an external device, dimensions of said cardbody fulfilling ISO standard ISO 7810, said electronic module havingcontact surfaces for touch contact, and said electronic module beingembedded in said card body at such a position that said contact surfacesare located in an area of said data carrier fixed by ISO standard ISO7816/2.
 2. The data carrier of claim 1, wherein said card body comprisesa gap for receiving said electronic module and said electronic module isglued into said gap in said card body in a manner offering goodprotection against splitting of said card body.
 3. The data carrier ofclaim 1, wherein said card body comprises a gap for receiving saidelectronic module and said electronic module is glued into said gap insaid card body with a liquid adhesive.
 4. The data carrier of claim 3,wherein said liquid adhesive moistens at least largely an entire wallarea of said gap so as to prevent splitting of said card body in saidwall area.
 5. The data carrier of claim 3, wherein said gap is providedwith at least one undercut filled with said liquid adhesive.
 6. The datacarrier of claim 1, wherein said card body is formed from single-layercardboard containing a gap for receiving said electronic module.
 7. Thedata carrier of claim 1, wherein said card body has a plurality oflayers and at least one of the outermost layers and at least one of theinner layers are provided with a window to form a two-step gap in whichsaid electronic module is embedded.
 8. The data carrier of claim 7,wherein said layers are interconnected by adhesive layers formed as oneof thermally activable layers and contact adhesive layers.
 9. The datacarrier of claim 8, wherein one of said adhesive layers connecting saidat least one of said outermost layers with said inner layers is exposedin a shoulder area of said two-step gap and serves to connect saidelectronic module with said card body.
 10. The data carrier of claim 1wherein surfaces of said card body are provided with a surface coatingand with a printed image.
 11. A data carrier formed as an IC cardconsisting of at least one of paper and cardboard, the data carrierhaving a card body made of at least one of paper and cardboard and anelectronic module for exchanging data with an external device,dimensions of the card body fulfilling ISO standard ISO 7810, theelectronic module being capable of noncontacting communication, and theelectronic module being embedded in the card body in such a way that itis surrounded on all sides by paper or cardboard.
 12. The data carrierof claim 11, wherein said card body has a plurality of layers, at leastone of the layers located between the outermost layers of said card bodybeing provided with a window for receiving said electronic module. 13.The data carrier of claim 12, wherein said layers are interconnected byadhesive layers formed as one of thermally activable layers and contactadhesive layers.
 14. The data carrier of claim 12, wherein saidelectronic module has an anchoring frame located between two of saidlayers of said card body.
 15. The data carrier of claim 14, wherein onesof said layers adjacent said anchoring frame are adhesive layers. 16.The data carrier of claim 11, wherein said card body is provided with asurface coating and a printed image.
 17. A method for producing datacarriers, comprising the steps of:(a) supplying cardboard with thethickness of said data carriers from a roll in endless form, (b)providing said cardboard with punchings at predetermined intervals sothat windows arise in the cardboard, (c) providing said cardboard withdebossing in the area of said windows so that depressions with a greaterdiameter than that of the windows arise in said cardboard in the area ofsaid windows, (d) inserting electronic modules in the resulting gaps inthe cardboard, whereby first areas of said electronic modules bearingcontact surfaces for contacting coupling are located in said depressionsand second areas of said modules bearing integrated circuits are locatedin said windows, (e) gluing said electronic modules in said gaps, and(f) punching individual data carriers out of said roll.
 18. A method forproducing data carriers, comprising the steps of:(a) supplying an uppercover layer, a lower cover layer and at least one core layer of at leastone of cardboard and paper each from a roll, (b) punching windows insaid core layer at predetermined intervals, bringing said core layer andsaid lower cover layer together and gluing them, whereby gaps arise insaid core layer at the positions of said windows, (c) introducing anelectronic module for noncontacting communication in said resultinggaps, (d) bringing said core layer together with said upper cover layerand gluing them together, and (e) punching individual data carriers outof the resulting band.
 19. The method of claim 18, wherein theindividual layers are interconnected by thermally activable adhesivelayers which are activated by heated laminating rolls.
 20. The method ofclaim 19, wherein:(a) at least a part of said core layers has throughholes which are filled with adhesive from said thermally activableadhesive layers during connection of said card layers so that the layersadjacent said core layers are interconnected indirectly via saidadhesive in said through holes, (b) said through holes are located inthe area of the punching edges along which individual cards are punchedout in a further step, and (c) said individual cards are punched out ofthe resulting sheet or band in such a way that said punching edgesextend through said through holes in said core layers.
 21. The method ofclaim 18, wherein the individual layers are interconnected by contactadhesive.
 22. A method for producing data carriers, comprising the stepsof:(a) supplying an upper cover layers, a lower cover layer and at leastone core layer of at least one of cardboard and paper each from a roll,(b) providing said core layer and said upper cover layer with windows bypunching, the openings in said cover layer being greater than theopenings in said core layer, (c) interconnecting the three layers,yielding a band having two-step gaps at predetermined intervals, (d)introducing electronic modules in said two-step gaps, whereby parts ofsaid electronic modules bearing contact surfaces for contactingcommunication are located in the upper areas of said gaps and parts ofthe electronic modules bearing integrated circuits are located in thelower areas of said gaps, and (e) punching individual data carriers outof the resulting band.
 23. The method of claim 22, wherein saidelectronic modules are inserted in the card structure before connectionof the individual layers, and are glued directly in said resulting gapsduring connection of said layers.
 24. The method of claim 22, whereinsaid electronic modules are glued into said gaps after connection of theindividual layers.
 25. A method for producing data carriers, comprisingthe steps of:(a) supplying an upper layer, a lower layer and at leastone core layer of at least one of cardboard and paper, (b)interconnecting the layers, yielding a band or sheet, (c) cutting in atleast said upper cover layer with a cutting tool at predeterminedintervals in such a way that the edges of cut include certain areas, (d)using a milling tool to produce gaps in said areas, whereby the limitsof said gaps located in said upper cover layer are fixed by said edgesof cut, (e) introducing electronic modules in the resulting gaps, and(f) punching individual data carriers out of the resulting band orsheet.
 26. A method for producing a data carrier, formed as an IC cardand having an embedded electronic module, comprising the steps of:(a)producing cardboard and (b) embedding said electronic module in saidcardboard during production of said cardboard in step (a).
 27. Themethod of claim 26, wherein said cardboard being produced has athickness of said IC card.
 28. The method of claim 26, furthercomprising providing said cardboard with at least one cover layer. 29.The method of claim 26, wherein said cardboard is produced as one of amultiple-copy sheet and a multiple-copy web in which a plurality of saidelectronic modules are incorporated in a matrix arrangement, andindividual data carriers are punched out of said multiple-copy sheet orweb in such a way that each of said data carriers contains at least oneof said electronic modules.
 30. The method of claim 26, whereinelectronic modules for noncontacting data exchange are embedded in saidcardboard, so as to be surrounded by said cardboard positively and onall sides.